Securities Times e Company NewspostcodemillionsSecond Link Lehman Optoelectronics (300162) announced on the evening of May 20 that recently, the concept of glass substrate has attracted the attention of market funds. According to market information, the advanced packaging process used by NVIDIA GB200 will use glass substrates; In addition, Intel, Samsung, AMD, Apple and other major manufacturers have previously stated that they will introduce or explore glass substrate chip packaging technology. After self-examination by the company: The glass substrate packaging technology in the above information refers to the use of glass-based carrier plates instead of traditional organic polymer carrier plates for semiconductor chip packaging, which belongs to the application in the field of semiconductor chip packaging. The company's new PM driven glass-based packaging technology is mainly used for Micro LED display panel packaging and cannot be used for semiconductor chip packaging. At the same time, the technology and process of the company's PM driven glass-based display products are constantly improving and improving, and no revenue has been generated at this stage.